With the deployment of 5G and the upcoming § ∞÷6G networks, the global demand & →for high-speed, large-bandwidth, ™♦♦and low-latency optical communicγ® ation has risen sharply. The TGV adva≠σ&☆nced packaging and 3D wave¥‍₩guide technologies of Sheng ¥≠uang Valley Technology provide b₹≠↔reakthrough solutions for 5G/6G comλ♠"©munication.

The TGV advanced packaging technology cγπ←∞an effectively break through the↔£∞∞ bandwidth bottleneck of the tr↓♥aditional Through Silicon Via (<☆TSV) technology and provide optoelectroni♦¶£c interconnection solutions with higher '™αbandwidth and lower loss. Through high-precisioφ£&÷n glass-based interposer chips and pre≠σ♣cise optoelectronic coupling, the TGV★πφ  technology can not only increase the tra✘∑α<nsmission speed of optical sig"✔∏×nals but also support larger-scale optical interc•γonnection systems. This is particularly crucial i→α✔n 5G/6G networks because w×↑ith the upgrade of the network architecture ♣§and the expansion of spectrum resources, t¥≥he bandwidth requirements of commun¥ §•ication systems have increased sharply. The TGV£♠∏ technology can meet these requirements, support≤λ high-speed data transmission in coherent opΩ₽ ™tical communication systems, and p∞×☆romote the efficient development of the next-gen Ω₹λeration optical fiber networks.∏¶σ≈

The 3D waveguide technology provides another α"efficient solution in 5G/6G networks. ∏≠Through the use of multi-core optical±• fibers and the integration of high↔¶₩&-density optical modules, the 3Dε  © waveguide technology can effectivel∑λβy support large-scale network d→♥​<eployment, simplify optical 'Ω≥fiber cabling, and improve the optical transmissi₽↔₹>on efficiency of the network. In addi™"≈tion, the 3D waveguide can also achieve <γ→'higher-density optical interconnection i&≤λn optical modules, support high-speed data t¥πransmission in 5G and 6G netwoπ∏rks, and ensure the efficient operation of§γσ communication networks.

The TGV and 3D waveguide technologies of Shenβ₹>guang Valley Technology pr↔β€γovide efficient and low-cost optoelectronic inte₽<✔rconnection solutions for 5G/6G netw&¶ ¶orks, promoting the development oφ€δf global communication networks towards•×¶ higher performance and lower σ≈✘ cost.