The 4 channels Tx TGV optoelectronic inte♣♣±rposer chip realizes glass-based signal t ‍ransmission through laser-i₩ £ nduced and deep silicon etching technologie∞‍s. By utilizing the redist"€ ribution layer (RDL) and micro-bumping pr£↓←ocesses, it achieves a wiring bandwidth of over₩™ ∞ 110GHz, significantly improving the signal trans♣<₹mission efficiency and density. <∏It matches the mainstream >✔♠four-channel silicon photonic modulation chiβ®'∏ps and electrical driver chips to realiβ‌ze a 4-channel standardized TGV interposer soluti≥→on. Meanwhile, it is compatible wi≈​♠th the pin definitions of mainstream silicon ¥"photonic chips and electrical chips, aδ¥>γnd supports 2.5D/3D stacking a₽≠nd packaging technologies to achieve a high♦♦‌" degree of integration in optoelectronic β↔↔>hybrid packaging. On the chi≠↓ ≥p, it can integrate the laser d'γirect writing optical waveguide and  $  the internal slotting of the interpose≤§∞r, realizing low-loss and high-density opticaε₹£ l path fan-in and fan-out.