1、Based on advanced 3D laser direct'> writing technology;
2、High optical transmittance from VIS ≠→to NIR;
3、Mode field diameter similar to optical fibγ→er;
4、Low dielectric loss, suitable for 20GHz+;
5、Compatible with TGV through-hole$±↓$ technology and silicon photonics process p₹αlatform;
6、High dimensional stability, thermal stabiliΩ≥¶ty and chemical stability;
7、Low transmission loss and coupling loss;
8、Circular cross-section, controllable size, com♦£‍₹patible with high-order modes.