The three-dimensional photonic in®←₩≈terconnection chip of Deep Optics Valley Technoε£logy adopts femtosecond laser d→×♠irect writing technology to precisely form a thr&♥♣¶ee-dimensional optical wavegu•©¶πide structure within the glass s₩β∑ubstrate. This chip is widely used in scenari♠≥os such as the interconnection between s✘≤>ilicon photonics chips and f γ±iber arrays, the fan-in and fan-out of mu'→€lti-core optical fibers, and high-density&≠¶✔ optical routing and switching. Its advantages i α→nclude an ultrafast waveguide writing speed,↑↓∏ an ultra-low waveguide transmission l₽¥​oss, a flexible routing desi☆>δgn, and excellent reliability, meeting the↓≥¥ requirements of high-performa''↔εnce photonic interconnections.