The TGVI high-speed T/ROSA optoelectronic&γ'↓ (OE) product leverages Deep Optics ValΩλβ☆ley’s proprietary TGV optoelectronic interpoπασδser chip, integrating laser-induced deep s<≈ ilicon etching, redistribution layer (RDL) patt&÷♣±erning, and micro-bumping processes to enab§♥le optoelectronic chip packaging intercoλ©λnnection and signal conversion §↔€on glass substrates. The self-de>‌↑veloped TGV interposer chip delivers a wiring ban∞≤★dwidth exceeding 110 GHz, significantly enhancing™∞ signal transmission efficie' ∏ ncy and density through opti∑♠•±mized interconnect archite<≥$cture. Designed for compatibil•☆×ity with mainstream silicon photonic modulatioφ♣π•n chips and electrical driver ICs, the ♦≤solution enables seamless integra♥☆tion of 4/8-channel standardi∞₽zed packages. It adheres to ind✔©™ustry-standard pin definitions&≥♥← for silicon photonic and electrical chips, ♣↑↔&facilitating high-density optoelec↑×♠tronic hybrid packaging with ♣↓minimized interconnection co↓©₩®mplexity.On-chip integration of laser-dir♣¥∏δect-written waveguides and interposer-in♦λ↑tegrated grooving structures supports l π₹ow-loss coupling with FAU (fiber array u★λnits), MT ferrules, and multi-core fibers (MCF♥​₽∞), enabling high-density opti® £cal fan-in/fan-out for advanced phot≈§δonic packaging applications.