8 channels Tx TGV Optoelectroβ✔nic Interposer Chip
The 8channels Tx TGV optoelectronic inte→σrposer chip uses laser induction and deep sili ε±con etching to achieve glass-b•αased signal switching, and uses the redis™•tribution layer (RDL) and micro-bump proc ±>₽ess to achieve a wiring bandwidth of m∏"ore than 110GHz, significantly improving sign→ 'al transmission efficiency and density; matchingσ"∞ the mainstream eight-channel silicon photonic mo±↔dulation chip and electric driver>↔☆π chip to achieve an 8-channel standardized solut©☆•ion, while being compatibl∞e with the pin definitions of mainstream silic♣Ωon photonic chips and electric chips, a©δ<αchieving a high degree of iα↓ntegration of optoelectronic hybrid packaging; l£'↔aser direct writing optical waveguides and inter&→poser internal slots can be integrated on the ¶↔chip to achieve low-loss and high-deφ₽>nsity optical path fan-in an∑®d fan-out.
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