In the field of AI intelligent comput↓>•←ing, with the rapid developmen♥φt of artificial intelligence ©±"♣technology, computing platfo →★rms need to continuously break through perf∏λormance bottlenecks to sup∏≤δport large-scale data processing and comp ©☆lex computing tasks. The TGV advan↔✘©ced packaging and 3D waveguide technolo>≈←gies of Shenguang Valley Technology p£ε>✘rovide an ideal optical interconneΩ₩×★ction solution for AI intelligent computing.
The TGV advanced packaging te₩€₹$chnology can provide a high-density and ♣<low-power consumption CPO optical engine so≥γπ¶lution for AI computing platfo©↔rms. Through the TGV technology, optiδ γcal interconnections between XPUs (such as§≠ ≥ GPUs, CPUs, TPUs) in the AI platform can achie✔γ₩¶ve higher transmission rates and low•&©er latency. This makes the data flow d→☆≈¶uring AI training and inference more e↓•£fficient, especially in large-s↑♠cale parallel computing, which↕∑÷ can effectively improve the overall perfor≈φ•↔mance of the system. At th&δ∑e same time, due to the low-power consumption c₩♦©haracteristics of the TGV technology, it ←→★ can significantly reduce energy consump≥±∞tion, ensuring that the AI c♥Ω♥omputing platform has a higher energy ef₹σ•ficiency ratio while maintaining high perforφ¶®∑mance, which meets the requirements of future g×∏☆reen computing.
The 3D waveguide technology can provide multi-δ≠♣channel high-density optical connectors for AI™™γ computing platforms, especia♣<✘∏lly suitable for silicon photoni&•cs chips. By combining the 3D waveguide technol©£±≈ogy with silicon photonics chips,δ©Ω↑ Shenguang Valley Technology can ach₹®≈ieve higher-density optical connections t∑↕>≈o meet the challenges of optical interconnections§∞& in large-scale AI computi÷★ng requirements. These high-density oλ↔®≥ptical connectors can ensure effic±₹ ient data exchange between different computing ×£↑units in the AI computing platform, thereby ↑±improving computing efficiency and d✔$©ata processing speed, providing a solid f¥λoundation for the rapid training and infer☆₩β♦ence of AI algorithms.
Through the TGV and 3D waveguide technol₹™¥ogies, Shenguang Valley Tec↔hnology has provided flexiblπλe and efficient optical interconnection solutio☆≥ns for AI intelligent comp♥"≠uting, supporting the development of th¥♦αe next-generation intelligent computing pla≠εtform and promoting further breakthr>¥β≈oughs in AI technology.
